-40%

60 Minute Silver Conductive Epoxy Glue Repair Kit 902, 2.5 grams

$ 10.55

Availability: 801 in stock
  • Benefits 2: Cold solder for heat sensitive components
  • Substrates 3: phenolic and G-10 epoxy glass boards.
  • Typical Applications 1: Electrical Conductive RMI EFI Shielding Circuitry
  • Condition: New
  • Country/Region of Manufacture: United States
  • Model: AA-DUCT 902-2
  • All returns accepted: ReturnsNotAccepted
  • Benefits 1: High strength Perfect bond
  • Brand: Atom Adhesives
  • Substrates 2: nickel, kovar, ceramic, glass
  • MPN: 902-2
  • Typical Application 2: printed circuit board and electronics repair
  • Substrates 1: aluminum, copper, magnesium, steel, bronze

    Description

    Technical Product Bulletin
    60 minutes
    Silver Conductive epoxy
    PRODUCT DESCRIPTION:
    This 60 Minute Conductive Epoxy is a two part,
    silver epoxy used in prototype, repair and
    general solder-less conductive bonding
    applications. It features
    strong mechanical
    bonds, superior electrical conductivity, and
    extended pot life for increased work time.
    Components can be easily placed and replaced
    before full cure occurs within 24 hours at room temperate or accelerated cure by heat cure at (100˚C) 212
    ˚
    F for 60 minutes.
    This
    conductive epoxy bonds
    strongly to a wide
    selection of materials/substrates.
    60 minutes
    epoxy is an adhesive and coating formulation based on pure
    silver.  This versatile silver
    formulation offers the maximum continuity of conductivity
    with an electrical resistivity value of less than 1
    x
    10
    -4
    ohm·cm.
    60 minutes
    epoxy
    is also characterized by a wide operating temperature range from –50 to +170°C.
    It
    is recommended for electronic bonding and
    sealing
    applications that require both fine electrical and mechanical properties.
    GENERAL PROPERTIES:
    Appearance
    Silver
    Cure Type
    Heat cure or Room Temperature
    Benefits
    High strength
    Perfect bond
    Cold solder for heat sensitive components
    60 minutes work time offers increased workability and extended pot life
    Mix Ratio by weight
    100:5 / Resin: Hardener
    Substrates
    Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
    Typical Applications
    Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair
    UNCURED PROPERTIES:
    Viscosity @ 25 °C  cps
    Paste
    Specific Gravity, mixed
    2.79
    Reactive solids contents, %
    100
    Pot Life
    60 Minutes
    Shelf life
    1 year
    CURE SCHEDULE:
    2 – 5 minutes
    @ 150°C
    15 minutes
    @ 100°C
    45 minutes
    @ 50°C
    24  hours
    Room temperature
    CURED PROPERTIES:
    Hardness, Shore D
    85
    Shrinkage linear in/in
    0.0003
    Lap shear strength, psi
    9400
    Volume Resistivity ohm. cm
    < 0.0001
    Thermal Expansion Coefficient,
    (cm / cm / °C · 10-5)
    1.5
    Thermal Conductivity,
    btu / hr / ft2 / °F / in:
    100
    Tensile Strength, psi:
    9,500
    Compressive Strength, psi
    14,000
    Heat Distortion, °C
    95
    Operating Temperature
    -50°c to +170°c
    GENERAL INFORMATION:
    For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
    HOW TO USE:
    1)
    Carefully clean and dry all surfaces to be bonded.
    2)
    Apply
    60 minutes
    epoxy
    completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong,
    reliable bonds; however, maintain contact until adhesive is completely cured.
    3)
    Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be
    thoroughly mixed prior to use.
    4)
    Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior
    to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for
    best results.
    AVAILABILITY:
    This epoxy can be supplied in various different packages.
    Froo www.froo.com | Froo Cross Sell, Free Cross Sell, Cross promote, eBay Marketing, eBay listing Apps, eBay Apps, eBay Application